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Control 3D coplanarity
This
operation allows to reduce, to eliminate, any risk of
rejection of a SMD's component during theboardassembly
on production lines.ELMITECH arranges the best equipments specialized in the control of parts, Gull wing, J-lead, CMS, BGA, before their insertion over CI.
Lead Scanning:
Damaged leads are a primary reason for failures in electronic manufacturing. ELMITECH uses automated lead scanning systems to verify that tolerances adhere to manufacturer or customer specifications. Lead scanning lowers parts per million (PPM) levels and increases product yields.
Packages : BGA - CSP
Packages: SOP - TSOP - QFP
